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It is valuable in analyzing the consequences arising from a failure or undesired event. The following phases can be used: On/off working phases with various average outside temperatures the equipment is exposed to. These models support permanent working, on/off cycling and dormant applications. Taking into account MOORE's law, it is necessary to know the manufacturing year to calculate the failure rate of integrated circuits. Permanent-working phases with various average outside temperature changes the equipment is exposed to.

However, only the greater temperature variation has to be taken into account, because the highest one has the main effect on the reliability of the device packages and on the mounting process. The thermal cycling seen by components during the variety of "mission profiles" undergone by the equipment, replace the difficult to evaluate environment factor of other standards. Average outside ambient temperature surrounding the equipment, during a phase of the mission profile Average ambient temperature of the printed circuit board (PCB) near the components during a phase of the mission profile Annual ratio of times for the PCB, in permanent working mode, and at the temperature Total annual ratio of time for the PCB, in non working or storage/dormant modes Annual number of thermal cycles seen by the components of the PCB, corresponding to the phase of the mission profile with an average temperature change Average change of the thermal variation seen by the components of the PCB, corresponding to a phase of the mission profile For a storage or permanent working phase, the average of the difference between maximal and minimal temperatures per cycle experienced by the equipment on the considered phase is used. This difference is due to residual overloads, since the equipment is assumed adequately protected. These lines of assurance include both engineered systems and human actions.

A mission profile has to be decomposed in several working phases, on the basis of a typical year of use. Event tree analysis is generally applicable for almost any type of risk assessment application, but used most effectively to model accidents where multiple safeguards are in place as protective features. For majority of the applications, a day is corresponding to one cycle, and temperature change?is corresponding to the annual daily mean of the daylight / night temperature difference seen by the equipment. If this value is below 3°C, it is assumed that the temperature change = 0. Failure rate related to component soldering/mounting is included in component failure rate. Conduct a screening-level risk assessment to identify the events of interest or categories of events that the analysis will address. Evaluate the recommendations from the analysis and the benefits they are intended to achieve. Benefits can include improved safety and environmental performance, cost savings, or additional output. The reliability of the components used in equipment located "at the heart" of a system, is significantly better than that of the components located at the periphery (connected to the external environment).

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Models the range of possible accidents resulting from an initiating event or category of initiating events A risk assessment technique that effectively accounts for timing, dependence, and domino effects among various accident contributors that are cumbersome to model in fault trees Performed primarily by an individual working with subject matter experts through interviews and field inspections Qualitative descriptions of potential problems as combinations of events producing various types of problems (range of outcomes) from initiating events Quantitative estimates of event frequencies or likelihoods and relative importance of various failure sequences and contributing events Define the system or area of interest. For an on/off working this daily variation is also applied on the equipment. The reliability of the components used in equipment located "at the heart" of a system, is significantly better than that of the components located at the periphery (connected to the external environment). Specify and clearly define the boundaries of the system or area for which event tree analyses will be performed. Particularly true for integrated circuits, this can be attributed to many factors to the credit of the manufacturers.

This is called life expectancy, and is subject to influencing factors. For each outcome of the event tree, determine the appropriate frequency and consequence that characterize the specific outcome. A mission profile has to be decomposed in several working phases, on the basis of a typical year of use. IEC 62380 does not support parts count only approach, because mission profiles are needed to calculate credible failure rate results. Identify the various safeguards (lines of assurance) that will help mitigate the consequences of the initiating event.

The thermal cycling seen by components during the variety of "mission profiles" undergone by the equipment, replace the difficult to evaluate environment factor of other standards. Also, identify physical phenomena, such as ignition or meteorological conditions that will affect the outcome of the initiating event. However, the integration density for integrated circuits continues to grow at the same rate as in the past, at constant reliability figure. Failure rate related to component soldering/mounting is included in component failure rate. Storage or dormant phases mode with various average outside temperature changes the equipment is exposed to. Relays, aluminum capacitors (with non-solid electrolyte), laser diodes, optocouplers, power transistors in cyclic operation, connectors and switches and keyboards are examples. However, there are cases where the occurrence of wear-out failures should be taken into account: Wear-out mechanisms may give rise to systematic failures after too short a period of time; electro-migration in active components is an example. Average outside ambient temperature surrounding the equipment, during a phase of the mission profile Average ambient temperature of the printed circuit board (PCB) near the components during a phase of the mission profile Annual ratio of times for the PCB, in permanent working mode, and at the temperature Total annual ratio of time for the PCB, in non working or storage/dormant modes Annual number of thermal cycles seen by the components of the PCB, corresponding to the phase of the mission profile with an average temperature change Average change of the thermal variation seen by the components of the PCB, corresponding to a phase of the mission profile For a storage or permanent working phase, the average of the difference between maximal and minimal temperatures per cycle experienced by the equipment on the considered phase is used. If this value is below 3°C, it is assumed that the temperature change = 0. The results of the event tree may also provide the basis for decisions about whether to perform additional analysis on a selected subset of accident scenarios.

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